Low Temperature Deposition of Magnesium Doped Nitride Films

Tech ID: 21919 / UC Case 2006-678-0

Brief Description

A method for growing an improved quality device by depositing a low temperature magnesium doped nitride semiconductor thin film.

Background

Magnesium doped gallium nitride has been extensively used in nitride based LEDs, but requires high deposition temperatures. Indium nitride has a high volatility and readily evaporates out of the InGaN films when exposed to a high enough temperature or a low temperature for an extended period of time. This time and temperature value is commonly referred to as the material's thermal budget. As a result, there is a need for improved methods for the growth of low temperature magnesium doped nitride planar films, wherein the thermal budget of the previously deposited indium nitride containing multiple quantum wells is considerably reduced.

Description

Researchers at the University of California, Santa Barbara have developed a method for growing an improved quality device by depositing a low temperature magnesium doped nitride semiconductor thin film. This process includes using deposition temperature for the magnesium doped GaN film that is lower than the one used for the deposition of the multi quantum well. This results in a significant increase in the output power of a nitride LED.

Advantages

  • Reduced damages to the multi quantum well materials
  • Increased output power of nitride LED and improved device performance

Applications

  • Nitride LEDs and Laser Diodes  

 

This technology is available for a non-exclusive license. See below for a selection of the patents and patent applications related to this invention. Please inquire for full patent portfolio status.

Patent Status

Country Type Number Dated Case
United States Of America Issued Patent 7,709,284 05/04/2010 2006-678
 

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Keywords

thin film, indssl, indled, cenIEE

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