Activation of P-Type Layers of Tunnel Junctions in Micro-LEDs

Tech ID: 32270 / UC Case 2021-551-0

Background

Current commercial III-nitride light emitting diodes (LEDs) and laser diodes (LDs) employ the use of an n-type region and a p-type region to form a diode. However, p-type gallium nitride (p-GaN) is difficult to contact electrically and has low hole concentration and mobility. As a result, p-GaN cannot be used as a current spreading layer, and traditional p-contacts will add significant voltage to devices. All commercial light emitting devices utilize traditional p-contacts and materials other than p-GaN for current spreading, which typically involves a high barrier for tunneling. Current methods to reduce the tunneling barrier are associated with losses, either in terms of voltage or resistance increases or optical losses in the final device performance.

Description

Researchers at the University of California, Santa Barbara have created a novel method for fabricating micro-LEDs with low forward voltage tunnel junctions enabling improved performance and integration of multicolor displays. This approach fabricates III-nitride μLEDs incorporating an epitaxial tunnel junction made of p+GaN, InxAlyGazN insertion layers, and n+GaN layers grown by MOCVD. The InxAlyGazN insertion layers possess a smaller bandgap than GaN, reducing depletion width and increasing tunneling probability, which leads to low and stable forward voltages across device sizes ranging from 25 to 10,000 μm². The approach also includes chemical treatment between growth steps to activate the p-type layer despite previously limiting hydrogen compensation challenges. These advancements enable better current spreading, simplified fabrication, higher output power, and facilitate cascaded integration of μLEDs emitting blue, green, and red light in a single device.

Advantages

  • Low and stable forward voltage
  • Simplified fabrication process using consistent MOCVD growth with minimal complexity
  • Improved current spreading via tunnel junctions on both device sides
  • Higher output power performance compared to traditional p-contact LEDs
  • Enables cascaded μLEDs with integrated multicolor emission (blue, green, red)
  • Stable voltage performance across varying device sizes, supporting commercialization

Applications

  • Next-generation micro-LED displays, including near-eye and head-up displays
  • High-brightness, low-power display panels for wearable and augmented reality devices
  • Multicolor display integration in compact micro-scale lighting systems
  • Advanced lighting applications requiring efficient, small-area light sources
  • Commercial and industrial LED lighting solutions benefiting from improved device efficiency

Patent Status

Country Type Number Dated Case
United States Of America Published Application 20230307579 09/28/2023 2021-551
 

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Keywords

p+GaN, n+GaN, MOCVD, micro-LED, tunnel junction, forward voltage, LED

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