A new approach to photonic integrated circuit fabrication.
Researchers at the University of California, Santa Barbara have developed a new method of photonic integrated circuit fabrication where quantum dot III-V material and silicon waveguides are both grown on silicon substrates and are bonded using the wafer bonding process. Using identical substrates overcomes many of the limitations associated with substrate dissimilarity and also enables further processing of the III-V material before and/or after the wafer bonding. The process also shows potential for scalable, high-yield production of photonic integrated circuits.
|United States Of America||Issued Patent||9,360,623||06/07/2016||2014-312|
indadvmat, photonic integrated circuit, advanced materials, silicon photonics fabrication, quantum dot III-V, silicon waveguides, wafer bonding process