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Browse Category: Semiconductors > Design and Fabrication


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Anti-Ferromagnetic Magneto-Electric Spin-Orbit Read Logic

UCLA researchers in the department of Electrical Engineering have developed a novel magetoelectric device for use as a spin transistor.

Full Color Quantum Dot Patterning Via Soft Lithography

UCLA researchers in the Department of Chemistry and Biochemistry have developed a novel quantum dot patterning method via soft lithography. It allows cost-effective, large-scale and high resolution full-color quantum dots patterning, which will revolutionize the nanoelectronics and QD-based display industries.

Polarization Standing Wave Cavity Assisted By Anisotropic Structures

Researchers in the Department of Electrical Engineering have developed a cavity demonstrating resonance through polarization standing waves.

Repeatable Ultra-Fast Low Jitter Spark Gap

UCLA researchers in the Department of Physics have developed a spark gap using a high dielectric material for pulsed laser applications.

Transparent Bulk Photoluminescent Quantum Dots/Polymer Nanocomposite

UCLA researchers in the Department of Materials Science and Engineering have developed highly transparent, photoluminescent nanocomposites containing record-high levels of quantum dots.

TSV coupling mitigation coding techniques in 3D-ICs

Three-dimensional network-on-chip (NoC) designs are a crucial aspect of 3D integrated circuit platforms, though they suffer from unwanted and often detrimental effects due to coupling between their vertical through-silicon via (TSV) connections. Recently, researchers at UCI have developed algorithm-based techniques to mitigate such TSV-to-TSV coupling, capable of >90% reduction of such interactions.

III-Nitride Vertical Transistor with Ion Implantation Formed Aperture Region

Researchers at the University of California, Davis have developed a method of fabricating a III-nitride vertical transistor with aperture region formed using ion implantation as a path to achieve selective area doping.

Resistive Memory Write and Read Assistance Using Negative Differential Resistance Devices

UCLA researchers in the Department of Electrical Engineering have developed a new design of read and write circuitry using negative differential resistance devices to improve the performance of resistive memories.

Data Shepherding: Cache Design For Future Large Scale Chips

The ability of a central processing unit to store frequently-used data in nearby, easily accessible cache data banks has revolutionized computational performance, though their effective implementation in multicore processors has become a technological challenge. Researchers at UCI have developed a new means of data caching that is fully applicable to multicore processors, and offers reduced memory access time over standard techniques.

A Hybrid Silicon Laser-Quantum Well Intermixing Wafer Bonded Integration Platform

An approach for integrating InP-based photonic devices together with low loss silicon photonics and complementary metal-oxide-semiconductor (CMOS) electronics.

Internal Heating for Ammonothermal Growth of Group-III Nitride Crystals

A new process for heating vessels used in the ammonothermal growth of group-III nitrides.

Current to Voltage Converter for High-Speed Optical Fiber Communications

The exponential increase in internet traffic due to the increased availability of internet access as well as high demand activities (such as movie streaming) presents an enormous challenge to infrastructure in handling this increasing amount of data. The UCI researchers have developed an ultra-broadband transimpedance amplifier (TIA), which is a key component for coupling high-speed optical fiber to conventional metal wiring. The silicon-based circuit is capable of 50 Gbps data transfer, representing a 25% increase over other, state of the art devices.

Three-Dimensional NoC Reliability Evaluation Automated Tool (TREAT)

The invention is a reliability analysis framework designed specifically and uniquely for 3D Network-on-Chip platforms. Following an innovative methodology together with accurate modeling for smart dynamic faults injection, the invention can effectively be used to avoid costly redesigns through assessments at earlier design stages.

Mechanical Process For Creating Particles Using Two Plates

UCLA researchers in the Department of Chemistry and Biochemistry & Physics and Astronomy have developed a novel method to lithograph two polished solid surfaces by using a simple mechanical alignment jig with piezoelectric control and a method of pressing them together and solidifying a material.

Two-Step Processing With Vapor Treatment Of Thin Films Of Organic-Inorganic Perovskite Materials

Prof. Yang and colleagues have developed a novel method of preparing organic-inorganic thin films using a solution process followed by vapor treatment, presenting a low-cost, high-performance solution method of producing optoelectronic devices.

Trademark: Flexible Fan Out Wafer Processing And Structure: Flextrate

UCLA researchers in the Department of Electrical Engineering have invented a novel biocompatible flexible device fabrication method using fan-out wafer level processing (FOWLP).

A Structure For Increasing Mobility In A High-Electron-Mobility Transistor

A technique that results in a significant increase of electron mobility and sheet charge density at small channel thickness.

Two-Dimensional Patterning Of Integrated Circuit Layer By Tilted Ion Implantation

The proliferation of information technology (IT) – which has had dramatic economic and social impact – has been enabled by the steady advancement of integrated circuit (IC) technology following Moore’s Law, which states that the number of transistors on an IC “chip” doubles every two years. In other words, the primary reason for increasing the number of components (transistors) on a chip is to lower the manufacturing cost per component. Increased integration also has the benefits of providing for improved system performance and energy efficiency. Therefore, the semiconductor industry has steadily scaled linear transistor dimensions, by a factor of approximately 0.7´ with every new generation of manufacturing technology, over the past 50 years. The most advanced chips today comprise over 10 billion transistors within an area of a few cm2. The pace of IC technology advancement has slowed down for the most recent generations, however, due to fundamental limits of the conventional photolithographic patterning process. Double-patterning techniques such as “self-aligned double patterning (SADP)” are used today to pattern IC layers with sub-45 nm feature size and minimum pitch, well below the wavelength of light used in the photolithography process. These techniques involve many additional steps, including extra lithography and etching processes, however, which result in increased cost of patterning.  To address the issue of increasing patterning cost, researchers at the University of California, Berkeley have developed a new method for patterning an IC layer with minimum feature pitch smaller than the minimum pitch of the photolithographic process and with minimum feature size smaller than the lithographic resolution limit, using well-established planar processing techniques.  A significant advantage of this new method is that it can be used to define two-dimensional layout patterns, which can provide for more compact integrated circuits.

Interleaved 3D On-Chip Differential Inductor And Transformer

UCLA researchers in the Department of Electrical Engineering have developed an interleaved three-dimensional (3D) on-chip differential inductors and transformers used in silicon based radio frequency/millimeter wave integrated circuits

On-Chip Tunable Artificial Dielectrics

UCLA Researchers in the Department of Electrical Engineering have developed and reduced-to-practice an innovative method for making chips with tunable dielectrics so the wavelength of RF signals can be modified to achieve frequency tuning effects without effecting noise interference.

All Microwave Stabilization Of Chip-Scale Frequency Combs

UCLA researchers in the Department of Electrical Engineering have developed an optical frequency comb technology using small, cheap components for high precision time, frequency, distance, and energy measurements.

High Performance and Flexible Chemical And Bio Sensors Using Metal Oxide Semiconductors

UCLA researchers in the Department of Materials Science and Engineering have developed a simple method producing thin, sensitive In2O3-based conformal biosensors based on field-effect transistors using facile solution-based processing for future wearable human technologies as well as non-invasive glucose testing.

Hemispherical Rectenna Arrays for Multi-Directional, Multi-Polarization, and Multi-Band Ambient RF Energy Harvesting

UCLA researchers in the Department of Electrical Engineering have developed a system that can receive RF waves in different frequency bands, from different directions, and with different polarizations to maximize energy harvested from ambient radio-frequency signals.

Advanced Chemical Sensing Method and Apparatus

Conventional chemical sensors or chemical resistors detect the molecule concentration by monitoring the resistance change caused by the reaction near the sensing material surface. One of the problems with these systems is with drift, when over time the analyte molecules poison the device’s sensing surface, causing weaker performance on selectivity and sensitivity. This often requires rigorous and timely calibrations to the sensor, which involves human intervention, and often times complete sensor replacement. To address this problem, researchers at the University of California, Berkeley, have developed a vertical platform that dramatically improves the sensor’s ability to manage and recover from the poison environments. By examining and manipulating the sensing plane vis-à-vis the near field surface, researchers have demonstrated an effective and robust chemical sensing platform for a range of gas sensing applications.

Highly wrinkled metal thin films using lift-off layers

Wearable electronics are becoming a popular way of integrating personal healthcare with continuous, remote health monitoring, yet current devices are bulky and exhibit poor electronic performance. Wrinkled metal thin films can be utilized for their thin, flexible profiles, which conform well to the skin. Researchers at UCI have developed a novel method using specialized materials that results in wrinkled metal thin films that have enhanced mechanical and electrical performance.

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