Silicon Origami: Folding Technology for Advanced MEMS Integration

Brief Description

This technology introduces a novel approach to MEMS integration, utilizing folding techniques to enable special distribution of sensor components and co-integration of multiple physical sensor modalities with control electronics in a compact formfactor.

Full Description

UCI researchers have developed a folding technology focused on creating three-dimensional structures from two-dimensional semiconductor wafers. It employs through-wafer electrical interconnects for double-sided functionality, enabling the co-integration of MEMS and integrated circuits. This technique allows for the folding of sensor arrays into three-dimensional shapes, significantly enhancing the performance and application possibilities of devices such as the Timing and Inertial Measurement Unit (TIMU). The technology also includes a process for creating multi-axis MEMS inertial measurement units (IMUs) within a single, vacuum-sealed package, offering unprecedented sensitivity and accuracy for motion detection across multiple axes.

Suggested uses

• Consumer electronics, particularly in enhancing the performance of smartphones and wearable devices. 
• Military applications, including navigation systems and augmented reality glasses. 
• Automotive industry, especially for advanced driver-assistance systems (ADAS) and autonomous vehicles. 
• Healthcare, for applications in wearable health monitors and advanced diagnostic equipment. 
• Augmented and virtual reality technologies, offering improved motion tracking and user experience.

Advantages

• Enables the creation of compact, high-performance multi-axis sensors. 
• Reduces cross-axis sensitivity, improving device accuracy and reliability. 
• Facilitates the co-integration of MEMS and electronic components, optimizing device functionality. 
• Offers a scalable approach to MEMS device fabrication with potential for mass production. 
• Size efficiency, with devices as small as 15 cubic millimeters, without compromising sensitivity.

Patent Status