Thermal Test Vehicle For Electronics Cooling Solutions

Patent Status

Patent Pending

Brief Description

As the density and performance of electronics continues to increase, thermal challenges have become a primary concern. Removing heat from electronic components can be extremely challenging, given their small size, electrical activity, and mechanical constraints. This necessitates the design of cooling solutions for a wide variety of electronic designs in applications such as datacenters, renewables, aircraft, etc.

To address this problem, researchers at UC Berkeley have developed a thermal test vehicle (TTV) for characterizing the performance of electronics cooling solutions under a wide variety of operating conditions. All of the TTV circuitry required to perform measurements and temperature estimations can be included on one printed circuit board (PCB). This represents a simple, highly flexible approach for thermal test vehicle design. The overall size of the array can be scaled to any desired amount.

This novel TTV represents a simple, highly flexible approach for thermal test vehicle design. Furthermore, its use of standard commercial electronic components allows for a vast reduction in cost compared to existing commercial solutions.

Suggested uses

• Thermal test vehicle for electronics cooling solutions
• High-performance controllable heater
• Testing equipment for data center comissioning

Advantages

• simple and highly flexible approach
• uses standardized commercial components
• reduces costs compared to existing commercial options

Related Materials