Researchers at the University of California, Davis and NHanced Semiconductors have developed a new optical interposer solution for embedded photonics that have higher energy efficiency than the current pluggable optics solutions
Data centers, or networked servers for the remote storage, processing, and distribution of large amounts of data, has merited the creation of photonics for high throughput communication. Currently, optical solutions are separate pluggable devices from the input/output (I/O) electronics, limiting energy efficiency and processing speed. Optical interposers that bring close integration of electronics and photonics are of strong interest but current photonic optical interposer design guides do not support close integration between photonics and electronics.
Researchers at the University of California, Davis and NHanced Semiconductors, in consultation with Polytechnic and Analog, have developed a new type of optical interposer than can work within a small proximity between photonics and electronics. This new type of embedded optics technology decreases the distance between the electronics and photonics to less than 1 mm, avoiding impedance effects (capacitance and skin-effect induced high resistance). It uses less energy than existing optical solutions and can self-align, potentially offering cost-effective, low loss, and robust integration in photonic/electronic communication. The silicon photonic interposer would work without the use of high-speed-through-silicon-vias (TSVs), allowing for rapid and efficient data communication within integrated circuits.
|United States Of America||Issued Patent||10,859,776||12/08/2020||2017-742|
optical interposers, photonics, embedded optics, electronics, interchip connections, cloud computing, bandwidth density, input/output electronics, I/O, high-speed-through-silicon-vias, TSVs, design guide, impedance, integration, integrated circuit