A New Method To Accelerate Tissue and Wound Healing Rates and Reduce Swelling and Scar Formation

Tech ID: 19823 / UC Case 2010-084-0


 Skin wounds are today typically treated with surface antibiotics and many different forms of bandages enriched with antibiotics and growth factors. There are numerous wound healing agents currently being used today.

Technology Description

UC San Diego inventors have come up with a novel approach to accelerate wound healing using a non-traditional pathway for treatment. At skin closure sites, the invention—compared to an untreated controls—produces reduced redness, swelling, exudates amount, tissue indurations, and scab formation around the incision site.
The invention is based on direct observations in rodent experiments involving skin wound closures. The exact rates of wound healing achieved by this method, as compared to control or other treatments, will be determined in experiments that are planned in the near future. Some preliminary unpublished results are available

Patent Status

Country Type Number Dated Case
United States Of America Issued Patent 8,841,258 09/23/2014 2010-084


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  • DeLano, Frank A.
  • Schmid-Schonbein, Geert W.

Other Information


wound healing

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