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Find technologies available for licensing from UC Santa Barbara.
Low-Cost, Highly Scalable Solution for Integration of Laser or Light Sources with Silicon Photonic Circuitry
A low-cost, highly scalable approach to integrating a compound-semiconductor laser or light source with silicon-photonic circuitry.
Advanced Tunable Long-Wavelength Vertical-Cavity Semiconductor Optical Amplifiers
A tunable long-wavelength vertical semiconductor optical amplifier (VCSOA) that is tunable over a wide wavelength range.
Integrated Reconfigurable Circulator
Photonic integrated circuit (PIC) comprised of an integrated non-reciprocal device that can be reversed, is monolithic, and can be integrated with lasers and modulators
Bonding of Heterogeneous Material for Improved Yield and Performance of Photonic Integrated Circuits
A new method of photonic integrated circuit fabrication where quantum dot III-V material and silicon waveguides are both grown on silicon substrates and are bonded using the wafer bonding process.
Enhancement Of Thermoelectric Properties Through Polarization Engineering
A novel method of enhancing the thermoelectric properties of materials used in thermoelectric power generation.
Integrated Bidirectional Optical Amplifier (BOA) for Optical Interconnects
Brief description not available
Integrated Dielectric Waveguide and Semiconductor Layer
A new technique for integrating ultra-low loss waveguides (ULLWs) with active silicon and/or compound semiconductor waveguides on a common substrate.
Ring Resonator-Based Optical Isolator and Circulator
The first nonreciprocal ring resonator and implemented it in a ring isolator, which has the main advantages of miniaturization and integration with other optoelectronic devices.
Loss Modulated Silicon Evanescent Lasers
Two novel alternative methods for modulating semiconductor lasers that enable much higher frequency modulation.
Fused Vertical Couplers
Wafer fusion is a powerful technique for fabricating structures that cannot be realized by conventional epitaxial growth and processing. Wafer fusion provides an extra degree of freedom in the design and fabrication of 3-D photonic devices. Large switch arrays can be produced by displacing the input and output waveguides vertically in different planes. Compact high-extinction-ratio directional couplers are essential to the switching process.