| Tech ID |
Title |
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| 23148 |
Controlling Contact Resistivity of Transparent Conductive Layers of Optoelectronic Devices
A novel method of altering the effective contact resistance between two semiconductor layers.
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| 23147 |
Fabrication of Green LEDs with Improved Performance
A novel invention which allows the fabrication of heterojuctions consisting of relaxed layers of crystals with the same lattice structure but different lattice constants.
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| 23146 |
(In,Ga,Al)N Optoelectronic Devices with Thicker Active Layers for Improved Performance
A novel invention to enable the fabrication of (In,Ga,Al)N optoelectronic devices with thick active layers containing a high concentration of indium (In).
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| 23145 |
Improved LED Performance via Optimized Polarization Properties
A novel method to engineer optical polarization properties.
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| 23144 |
Outdoor Street Light Fixture with Novel Laser Diode Light Source
A novel light source for street lights and other outdoor lighting applications using a laser diode.
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| 23142 |
GaN-based Green/Red Light-Emitting Diodes With Low Voltage
A novel method to fabricate high-performance, low voltage GaN-Based green LEDs and laser diodes (LDs).
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| 23115 |
Micro-electromagnetically Actuated Latched Switches
University researchers have developed a miniature relay switch, with an overall volume of less than 100 mm3 that can handle up to 40 W of DC or 60 Hz line power. This invention also relates to methods of manufacturing these relay devices directly within or on any of the following using standard electronic manufacturing techniques: lead frames, substrates, microelectronic packages, printed circuit boards, flex circuits, and rigid-flex materials.
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| 23079 |
Efficient High-Power, Laser-Driven White Lighting Device
A novel device that uses a combination of laser diodes and phosphors to create efficient, high-power white lighting.
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| 23078 |
Novel Layer Structure for Semipolar InGaN/GaN LEDs and Laser Diodes
A new method for the fabrication of semipolar InGaN/GaN LEDs and laser diodes.
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| 23077 |
Two dimensionally relaxed III-N buffer layers for LEDs
A new method of relaxing buffer layers which changes the effective lattice constant of the substrate while preserving the crystal quality of above grown layers.
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| 22905 |
Enhanced Coupling Geometry For Edge Lit Displays, (Tv, Display, Lighting)
LED edge lit displays
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| 22801 |
Photoelectrochemical Etching for Laser Facets
A method for photoelectrochemical etching of laser facets.
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| 22799 |
High Efficiency and High Brightness LEDs for Various Lighting Applications
A novel approach for producing a GaN-based semi-polar-oriented light emitting diode (LED) that contains a thin p-type GaN layer and no AlGaN electron-blocking layer (EBL).
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| 22796 |
LED Device Structures with Minimized Light Re-Absorption
A III-nitride light emitting diode (LED), in which light can be extracted from two surfaces of the LED before entering a shaped optical element and subsequently being extracted to air.
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| 22789 |
High Efficiency LED with Optimized Photonic Crystal Extractor
New LED structures that provide increased light extraction efficiency while retaining a planar structure.
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| 22788 |
Single or Multi-Color High Efficiency LED by Growth Over a Patterned Substrate
New LED structures that provide increased light extraction efficiency while retaining a planar structure.
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| 22786 |
Phosphor-Free White Light Source
A phosphor-free white light source, where an indium-containing light-emitting layer, as well as subsequent device layers, is deposited on a textured surface.
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| 22662 |
Simplified Daylight Harvesting
With support from the Public Interest Energy Research (PIER) program of the California Energy Commission (CEC), the California Lighting Technology Center (CLTC) has developed the foundations for a simplified on/off and stepped dimming control system for bi-level lighting applications. The new simplified daylighting control system is composed of a microcontroller, a photo sensor, an optional occupancy sensor and optional user controls. These components can be integrated into single product/units, or be combined through wired and/or wireless communications for a variety of products and systems. The new technology offers auto- and continuous calibration, along with user adjustable on/off set points for light switching. California utility members of the CLTC Advisory Council (PG&E, SCE, SDGE and SMUD) have reviewed the new technology and have expressed strong interest in supporting demonstrations of emerging technologies.
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| 22365 |
Low Carrier Loss Device Structure for High Performance Green LEDs
A novel light-emitting device structure that reduces the effects of these misfit dislocations by maintaining low carrier loss in the active region of the device.
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| 22295 |
LED Structure with Low Efficiency Droop for High-Current Applications
A novel LED structure that shows reduced droop effects when driven with high currents.
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| 22081 |
Hybrid Polymer Light-Emitting Device
A novel type of hybrid polymer light-emitting device that combines some of the characteristics of polymer light emitting diodes (PLEDs) and polymer light-emitting electrochemical cells (PLECs).
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| 22060 |
Binaphthol-Based Chromophores for Fabrication of Blue LEDs
A blue electroluminescent material based on a binaphtyl compound.
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| 21958 |
Fabrication of Optoelectronic Devices with Embedded Void-Gap Structures
A variety of techniques to improve the performance of LEDs and laser diodes by embedding photonic crystals or voids into the optoelectronic devices.
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| 21924 |
Semipolar III-Nitride Laser Diodes with Etched Mirrors
A semipolar III-nitride based laser diode employing a cavity with one or more etched facet mirrors.
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| 21921 |
Growth of Polyhedron-Shaped Gallium Nitride Bulk Crystals
A method to grow polyhedron-shaped GaN bulk crystals, which are not possible using existing growth methods.
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| 21920 |
Growth of Group III-Nitride Crystals using Supercritical Ammonia and Nitrogen
An ammonothermal growth method for high-quality group III-nitride bulk crystals at commercially practical growth rates.
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| 21919 |
Low Temperature Deposition of Magnesium Doped Nitride Films
A method for growing an improved quality device by depositing a low temperature magnesium doped nitride semiconductor thin film.
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| 21913 |
Photonic Structures for Efficient Light Extraction and Conversion in Multi-Color LEDs
Multiple-light source LEDs that provide increased light extraction and conversion efficiencies, as well as increased brightness, while retaining planar structures.
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| 21909 |
Method for Growing High-Quality Group III-Nitride Crystals
A novel method for growing group Ill-nitride crystals in supercritical ammonia.
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| 21832 |
Method for Producing GaN Substrates for Electronic and Optoelectronic Devices
A method for fabricating low cost, large scale, thin film substrates in the III-nitride materials family.
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| 21831 |
Mirrorless LED with High Luminous Efficiency
A light emitting diode (LED) that combines a high-efficiency LED chip with shaped phosphor layers to increase the total luminous efficacy of the device.(UC Case 2007-272 and 2007-273)
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| 21829 |
High-Efficiency, White, Single, or Multi-Color LED by Photon Recycling
An LED design that can emit white, single, or multi-color light.
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| 21824 |
Selective Dry Etching of N-Face (Al, In, Ga)N Heterostructures
A novel method for selective dry etching of n-face (Al, In, Ga)N heterostructures that is reproducible and scalable, making it viable for mass production, and that exhibits an extremely high etch selectivity.
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| 21823 |
Nitride-Based LED with Optimized Efficiency
A device with increased efficiency by combining shaped high refractive index elements with an (Al, Ga, In)N LED and shaped optical elements.
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| 21822 |
Device Structure for High Efficiency LED
A novel device structure that reduces light absorption inside the LED, enables uniform light emission from the active layer, and reduces light reflections occurring repeatedly inside the LED, thus increasing the overall efficiency.
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| 21820 |
Etching Technique for the Fabrication of Thin (Al, In, Ga)N Layers
A safe etching technique for use with (Al, In, Ga)N materials.
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| 21809 |
Cleaved Facet Edge-Emitting Laser Diodes Grown on Semipolar GaN
Highly-efficient cleaved facet edge-emitting laser diodes grown on semipolar gallium nitride substrates.
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| 21808 |
Yellow-Emitting Phosphors for White LEDs
Yellow-emitting phosphors, for fabrication of white LEDs.
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| 21806 |
Asymmetrically Cladded Laser Diode with Improved Performance
An asymmetrically cladded laser diode that achieves a low threshold current density and improved lasing behavior due to its structure.
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| 21391 |
Zwitterionic Electron Injection Layers for Highly Efficient Polymer LEDs
A novel composition for electron injection layers applicable in PLEDs.
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| 21369 |
Water-Soluble ETL Polymers for LEDs
Compositions of conjugated polymers, applicable to many electronic fields.
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| 20915 |
Recycle Gas Cooled Solid Oxide Fuel Cell (Rgc-Soft).
A fuel cell is an electrochemical device similar to a battery that converts chemically bound energy directly into energy. There are various types of fuel cells and the solid oxide type fuel cell has the advantage of a high operating temperature which results in a high exhaust temperature. Researchers in UCI’s Advanced Power and Energy Program have utilized this high exhaust temperature to maximize the power efficiency and quality via recycling gas through the SOFC system.
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| 20701 |
Reflector System for an Efficient Lighting Fixture
A reflector system for dispersing light from a light fixture.
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| 20567 |
Nanostructured Electron-Injection Materials and Electroluminescence Method and Device
Lighting is a major contributor to electricity consumption, accounting for 19 percent of global use and 34 percent in the U.S. The U.S. lighting market is currently dominated by the incandescent light bulb, which is only 5 percent efficient whereas the fluorescent lamp is 15 to 25 percent efficient. Solid-state luminaires, which are typically based on light-emitting diodes (LEDs), have the potential to revolutionize the industry with higher efficiency, better quality, and lower maintenance, possibly leading to a reduction of half the energy consumed by general illumination. For example, 30 percent efficiency has been achieved in a commercially available white LED and 50 percent in a laboratory white LED device. White light in such devices is produced either by combining light from different color LEDs or taking blue or near-UV light from an LED to “pump” a mixture of phosphors. The phosphor approach, when implemented with conventional phosphors, produces cold white light that is not color tunable and has non-optimal efficiency, but has the potential to overcome these shortcomings with the use of advances in materials.The appreciable energy savings derived by converting from incandescent to fluorescent lamps and solid-state lighting has spurred government measures towards phasing out incandescent light bulbs. The general lighting market is predicted to exceed $130 billion by 2011 with the LED-based share forecasted to grow to $1.4 billion by 2012. There is clearly an unmet need and great market opportunity for new energy-efficient lighting devices.
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| 19316 |
Low Temperature Wafer Bonding For Microwave and Power Electronics
A new method using low temperature bonding to fabricate optoelectronic and electronic devices.
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| 19306 |
Improved MEMS, Self-Powered, Wireless AC Electricity Sensors
Growing public awareness of energy issues indicates a latent demand for consumer as well as industrial scale products that monitor and manage energy use and efficiency across the grid from residential and industrial buildings, to power distribution and transmission lines. This latent demand could be addressed by the latest advances in micro-electrical mechanical system (MEMS) sensors technology, wireless radios, and energy scavenging. UC Berkeley researchers have addressed this market opportunity by leveraging the technology advancements to develop improved MEMS AC electricity sensors. These Berkeley sensors are self-powered and wirelessly networked. They can be used to establish ubiquitous networks of electricity sensors thereby enabling smart grids for energy monitoring as well as management application such as demand response.
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| 19158 |
High Efficiency LED With Emitters Within Structured Materials
Novel LEDs, where the emission region is structured in order to have efficient light extraction.
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| 18061 |
MEMS Passive, Wireless, Proximity Current Sensor For Circuit Breakers
The advent of AC current proximity sensors that are passive, wireless, low-costs, and easy to install as well as maintain, enables numerous new energy management application. To take advantage of this technology-enabling opportunity, researchers at UC Berkeley have applied the latest MEMS AC sensor technology to circuit breakers. In this application, the current sensors can be easily attached to the fronts of the breakers installed in breaker boxes – these boxes are common in residential, office and commercial buildings. This type of installation doesn’t require exposure to hazardous wiring, and therefore a professional (expensive) electrician isn’t required for the installation.
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| 18055 |
MEMS Self-calibrating, Proximity-based Sensors for AC Electric Current
In order to improve energy efficiency and correspondingly lower energy use and cost, there is growing interest in improving the intelligence of electricity usage across the grid – including down to the level of common electronic devices that use single wire or two-wire “zip-cord”. To enable this ubiquitous level of intelligent electricity usage, AC current sensors will be needed that are inexpensive to make, simple to install, and easy to maintain. However AC current sensors with these attributes have not been developed. To address this challenge, researchers at UC Berkeley have developed an integrated sensor device that can measure AC electric current in a wire or wires that are operating in proximity to the device without requiring (1) electrical contact with, or physical encirclement of the conductors, or (2) precise spatial orientation or precise physical mounting/placement of the sensor device relative to the conductors. These attributes make the sensor inexpensive to manufacture, easy to install and simple to maintain.
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| 10311 |
Electrically-Pumped Vertical-Cavity Surface-Emitting Laser (VCSEL)
Due to several inherent advantages of VCSEL devices, such as their ability to form densely packed arrays, on-wafer testing, and low power consumption, VCSELs offer a lower cost alternative to traditional edge-emitting lasers and improved performance over light emitting diodes (LEDs). Until the development of the present invention, (Ga,In,Al)N VCSELs only existed as optically pumped structures. Such structures require the implementation of large and costly pumping lasers, which limits their practical and commercial utility.
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| 10284 |
Paracyclophane Molecules for Two-Photon Absorption Applications
Organic molecules that absorb two or more photons simultaneously have wide applications in a variety of technologies involving such subjects as optical data storage, 3-D microfabrication techniques, frequency upconverting lasing, optical power limiting, photodynamic therapy, initiators of polymerization reactions, and multi-photon fluorescence microscopy for biological imaging.
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| 10278 |
Brighter Organic Light Emitting Diodes
Triplet emitters are promising materials for creating bright organic light emitting diodes (OLEDs). Iridium (Ir) organometallic complexes are especially attractive because of their high quantum yield of phosphorescence and their tunability over a broad emissive spectral range. However, at high carrier injection rates, saturation of emissive states and triplet-triplet quenching limits OLED performance. Thus, there is a need to accelerate Ir radiative decay in OLEDs while keeping other optical properties unperturbed.
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| 10277 |
Nonpolar (Al, B, In, Ga)N Quantum Well Design
A novel approach to designing high-performance nonpolar quantum wells.
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| 10129 |
Method To Reduce The Dislocation Density In Group III- Nitride Films
Due to the lack of availability of crystalline GaN substrates, epitaxy of GaN is most commonly performed on sapphire or silicon carbide substrates. GaN of comparable quality has been achieved on both types of substrates using a two step growth process. The process involves depositing a thin AIN or GaN layer at temperatures between 400 and 900 C, ensuring a complete wetting of the sapphire or SiC substrate, followed by the deposition of the main layer at temperatures above 1000 C. Depending on the actual growth condition, GaN layers with dislocation densities between 108 to 109 cm-2 can be obtained. A process known as lateral epitaxial overgrowth (LEO) was developed to improve the structural properties of such GaN layers. In this method, the GaN layer is partially covered with a mask. Growth starts exclusively in the remaining openings and the layer laterally overgrows the mask regions. Almost dislocation free material is obtained above the masked regions but dislocations remain above the open areas and at the intersections of merging growth fronts. The procedure can be repeated to deal with the remaining dislocations by placing the mask on the former openings and intersections. The resulting GaN epitaxial layers are of high quality, but the fabrication process involves several alternating growth and processing steps and very thick GaN films are deposited. These problems make the LEO approach very expensive and may limit its application to devices whose properties are extremely sensitive with respect to the presence of dislocations.
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| 10088 |
Fabrication Of High Quality P-Type GaN and Alloys by Preventing Hydrogen Incorporation
A novel processing technique to prevent hydrogen incorporation.
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