Electrostatic Methods and Apparatus for Mounting and Demounting Particles from a Surface Having an Array of Tacky and Non-Tacky Areas
Tech ID: 21051 / UC Case 2002-091-0
Technology DescriptionAs part of the Tacky Dot® donation, the University is offering for commercialization an improved method for mounting particles on a substrate having both tacky and non-tacky areas using a direct current potential This invention especially has utility for the handling and transfer of solder balls and other conductive particles to form solder bumps on the contact pads of electronic devices.
State Of DevelopmentThe method is widely applicable and is available for many fields of use.
- See also the News Release of the Department of Science and Engineering for information on the donation. Use of the trademark can also be made available.
|United States Of America||Issued Patent||7,191,930||03/20/2007||2002-091|
2002-091-0, 2002-823-1, 2002-824-1
solder bumping, particle mounting, microscopy, semiconductor fabrication, flat panel displays, photocatalytic materials, environmental cleanup
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- Improved Method and Apparatus for Adhering and Centering Particles to the Tacky areas on a Surface Containing an Array of Tacky and Non-Tacky Areas