Electrostatic Methods and Apparatus for Mounting and Demounting Particles from a Surface Having an Array of Tacky and Non-Tacky Areas
Tech ID: 21051 / UC Case 2002-091-0
Technology Description
As part of the Tacky Dot® donation, the University is offering for commercialization an improved method for mounting particles on a substrate having both tacky and non-tacky areas using a direct current potential This invention especially has utility for the handling and transfer of solder balls and other conductive particles to form solder bumps on the contact pads of electronic devices.State Of Development
The method is widely applicable and is available for many fields of use.Related Materials
Patent Status
| Country | Type | Number | Dated | Case |
| United States Of America | Issued Patent | 7,191,930 | 03/20/2007 | 2002-091 |
Other Information
Related cases
2002-091-0, 2002-823-1, 2002-824-1
Keywords
solder bumping, particle mounting, microscopy, semiconductor fabrication, flat panel displays, photocatalytic materials, environmental cleanup
Contact
University of California, San Diego Technology Transfer Office / invent@ucsd.edu / tel: View Phone Number. Please reference Tech ID #21051.
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