Multicolor III-Nitride LED or Micro-LED Displays Using Wafer Bonding

Tech ID: 32269 / UC Case 2020-713-0

Background

Conventional multicolor inorganic LED or micro-LED pixel arrays (displays) are hindered by the inefficiency and cost of combining multiple devices of various wavelengths onto a single substrate. Traditional approaches to manufacturing these arrays often include an individual pick-and-place method to arrange single pixels on a display. Consequently, display fabrication is a costly and timely process.

Description

Researchers at the University of California, Santa Barbara have developed a technique in which all pixels – even entire displays – can be bonded simultaneously using routine semiconductor wafer-bonding methods. With this technology, red, green, and blue LEDs are fabricated as a multi-LED stack pixel device in which multiple LED epiwafers are separately processed, combined via wafer bonding, and stealth diced into a single device. Stealth dicing also enables individual wafers within the stack to allow electrical contact to reach lower wafers. In addition, areas of the epiwafers may be removed to allow access for electrical contacts or to open optical windows. Therefore, these multi-LED stack pixel devices can be produced for displays at low costs and in a highly efficient manner.

Advantages

  • Increased fabrication efficiency
  • Decreased manufacturing costs
  • Additional device design opportunities

Applications

  • LEDs
  • Micro-LEDs

Patent Status

Patent Pending

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Inventors

Other Information

Keywords

micro-LED, LED, wafer bonding, multicolor, stealth dicing, multi-LED, semiconductor

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