Brief description not available

Brief description not available

Prof. Guillermo Aguilar-Mendoza and his research team including colleagues from the University of California campuses in Riverside and San Diego have developed an all ceramic, biocompatible, hermetically sealed package for encapsulating electronics. This technology uses disparate transparent polycrystalline ceramics and is sealed by ultrafast lasers. The laser directly joins the disparate surfaces, protecting the electronic device from damage while ensuring a high-quality seal. The inventors strategically considered both the optical properties of the polycrystalline ceramics (linear and non-linear absorption - NLA) and the laser parameters (exposure time, number of laser pulses and pulse duration - femto second versus pico second). Two different concepts have been identified: Transparent ceramics for hermetic encapsulation; and,Diffuse ceramics to demonstrate joining of simple geometries. In the above image - (a) is a schematic illustration of concept 1 above; (b) picture of a sample electronic payload (an integrated chip) placed inside a ceramic tube; (c) picture of successfully welded assembly of concept 1 - the background pattern (pitch 3.5 mm is visible through a transparent ceramic cap; (d) schematic of concept 2 for welding simple ceramic geometries; and, (e) picture of a successfully welded assembly of Alumina and Ytria-stabilized Zirconia (YSZ).   Picture of transparent ceramics fabricated at UCR.