Piezoelectric materials are key components in a range of devices including acoustic imaging, energy harvesting, and actuators and typically rely on brittle ceramic monoliths to perform their functions. To control the size and or shape of the piezoelectrics, it is common to use mechanical dicing or saws. However, this limits not only the size of the piezoelectric element but also the dimensionality. It is nearly impossible with current cutting techniques to shape brittle ceramics into higher order 3D structures, which could have a huge impact on compact sensor designs, tunable acoustic arrays, efficient energy scavengers, and diagnostic devices. There is an unmet need for simple approaches to fabricating 3D structures in piezoelectric polymers or multilayered architectures which would open up infinite possibilities in the design of more complicated device geometries.