Deep-subwavelength Photolithography
Tech ID: 18024 / UC Case 2009-021-0
Abstract
Photolithography is the most widely used micro-fabrication technique as it is a parallel, cost effective, and high throughput process. However, conventional photolithography techniques have a resolution limit that is about half of the illumination light wavelength in free space. To date, various approaches to improve photolithography resolution have developed, but each is flawed. For example, electron-beam lithography, focused ion-beam lithography and dip-pen lithography are slow series processes not suitable for large-area pattern fabrication, and implementing reduced wavelength illumination drastically increases instrument complexity and cost.
To address these problems, Researchers at UC Berkeley have developed a family of deep-subwavelength photolithography technologies. These novel technologies are based on adding an artificial metal-dielectric structure to conventional photolithography processes to fabricate reduced patterns of the conventional photolithography masks. The technique overcomes the resolution limit of the conventional photolithography and can achieve deep-subwavelength resolution comparable to that of plasmonic nanolithography and near field contact photolithography. Furthermore, it can fabricate large-area uniform patterns while plasmonic nanolithography can not.
Applications
Nanolithography
Large Area Photolithography
Advantages
A parallel, cost effective, and high-throughput process
Completely compatible with conventional photolithography
Achieves deep-subwavelength resolution comparable to that of plasmonic nanolithography and field contact photolithography
Fabricates large area uniform patterns
Can fabricate reduced patterns of masks, unlike near field contact photolithography, which can only fabricate patterns identical to the masks
Patent Status
Patent Pending
Other Information
Categorized As
Related cases
2009-021-0
Keywords
Nanotech, thin films, digital circuits, composites, engineering, digital circuits: ASICS, semiconductor, general engineering, digital circuits: memory, other, superconductors, electronics packaging, materials, digital circuits: microprocessors, analog circuits, processing: lithography
Contact
Curt Theisen / curt@berkeley.edu / tel: View Phone Number. Please reference Tech ID #18024.
