Please login to create your UC TechAlerts.
Request a new password for
A Low-Cost-Wafer-Level Process For Packaging MEMS 3-D Devices
Operation Frequency Band Customizable and Frequency Tunable Filters with EBG substrate
Composition Structure with Tessllated Layers
Efficient Supercapacitator Charging Technique by a Hysteretic Charging Scheme
Micro implantable neural interface with electrophysiological and fluid delivery capability