UCLA researchers in the department of Electrical Engineering have developed a novel fabrication process for microstrip patch antennas with size reduction and dual band capabilities.
In recent years, mobile wireless communication devices have seen a dramatic trend in decreased weight and size. This trend has created a need for advanced antenna designs that fulfill wireless system requirements. Microstrip patch antennas, which control the direction of a beam of radio frequency energy (RF) over a large scan volume, are widely used in wireless communications due to their low cost and device miniaturization capabilities. However, as devices get smaller, new techniques for microstrip patch antenna miniaturization with satisfactory performance are required.
Researchers at UCLA have developed a novel fabrication process that reduces microstrip patch antenna sizes by 20% and provides dual band operation. The miniaturization is achieved by introducing periodic ripples on a low-loss silicon substrate, which are easily fabricated and tuned through low cost techniques. Dual frequency operations are possible without compromising antenna miniaturization effects. In addition, sinusoidal graphene sheets can be created and used for radiation in the GHz or THz range.
|United States Of America||Published Application||20170324166||11/09/2017||2015-180|
RF devices, microstrip patch antennas, wireless communication, telecommunication, dual band antenna, miniaturization, rippled microstrip line