Periodically Rippled Antenna

Tech ID: 29038 / UC Case 2015-493-0


UCLA researchers in the Department of Electrical Engineering have designed a periodically-rippled microstrip patch antenna for wireless communication systems.


Advancements in communication engineering and integration technology demand size reduction of low frequency antennas. Multiband operation and miniaturization in microstrip patch antennas have received interest due to their simple design and low manufacturing costs. However, conventional miniaturization techniques using high permittivity dielectric materials result in poor device performance. Rippled structures can overcome these size reduction limitations.


UCLA researchers have developed a periodically-rippled patch antenna structure for microwave integrated devices. The rippled structure results in a 26% size reduction compared to regular antennas, as well as dual-mode operation. Miniaturization is achieved while maintaining device performance comparable to industry standards. The device has low manufacturing costs and is compatible with industry microfabrication techniques. Moreover, metals or graphene can be readily deposited onto the structure and increase the device’s versatility.


  • Wireless communication systems (mobile phones)
  • RF, microwave devices
  • Microelectronics


  • 26% size reduction
  • Device performance comparable to industry standards
  • Low manufacturing costs
  • Readily integrates new materials

Related Materials

  • M. Yazdani, A. Navabi, P.Khalili, K. Wang, “Size reduction and dual mode degeneracy in microstrip patch antenna using periodically rippled silicon substrate.” 2015 IEEE MTT-S International Microwave Symposium.

Patent Status

Country Type Number Dated Case
United States Of America Published Application 20180123251 05/03/2018 2015-493


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  • Wang, Kang L.

Other Information


Microstrip patch antennas, RF/ microwave devices, miniaturization, dual band antenna, rippled microstrip line

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