Improved universal fixture for testing spatial power combined amplifiers in a metallic waveguide, as well as an improved amplifier itself.
The use of solid-state power combining amplifier techniques has continued to be of interest because of considerations pertaining to size, weight, reliability and manufacturing cost. In the context of microwave/millimeter-wave systems, for example, power combining amplifier techniques are of significance since those systems potentially provide larger output power than a single solid-state amplifier. In an application where a large number of microwave/millimeter-wave amplifiers must be combined, conventional power combining amplifier techniques have performed at lower than optimal levels. Multiple solid-state amplifiers are successively combined using two-way adders. But as the number of amplifiers becomes large, the power combining efficiency can become too low. Other contributing factors to decreased efficiency are resistive, radiative, and dielectric losses.
Researchers at the University of California, Santa Barbara have developed improved universal fixture for testing spatial power combined amplifiers in a metallic waveguide, as well as an improved amplifier itself. This apparatus can utilize multiple cards or arrays of solid-state amplifiers such that the cards can be maintained in a spaced apart relationship. The cards remain easily removable so that other cards having different amplification devices or different heat removal structures may be readily used in the apparatus.
This technology is available for licensing.
|United States Of America||Issued Patent||6,028,483||07/04/2000||2000-082|