Photolithography High Resolution Patterning

Tech ID: 22230 / UC Case 2011-303-0

Brief Description

Photolithography, an essential process in the fabrication of integrated circuits, has undergone continuous advancements that allow patterning of nanometer sized features. For example, features as small as 50 nm can be made by using excimer lasers with wavelengths of 248 nm and 193 nm (i.e., deep ultraviolet light). However, it is not always feasible for scientists to use the short wavelength lasers because they are expensive. A method that allows for high resolution photolithography without large capital expenses will be very useful.

Researchers at the University of California, Irvine have developed a photolithography method that allows for high resolution patterning. By using this method, one can get a 20-fold improvement in the limit of resolution in comparison to the inherent resolution of “top-down” processing. In addition, the method is easy to use, inexpensive, and does not require sophisticated instrumentation.

Suggested uses

The method may be used for micro/nano fabrication for electronics, integrated circuits, and microfluidics.

Patent Status

Country Type Number Dated Case
United States Of America Issued Patent 9,625,819 04/18/2017 2011-303


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Other Information


Photolithography, Microfabrication, Microfluidics, Resolution

Categorized As

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