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Nano Structure For Electrical Interconnect Including Integrated Circuit Mounting
Tech ID: 17325
/ UC Case 2004-018-0
Abstract
Patent Status
Country
Type
Number
Dated
Case
United States Of America
Issued Patent
8,610,290
12/17/2013
2004-018
United States Of America
Issued Patent
7,476,982
01/13/2009
2004-018
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Michael Cohen
mcohen@berkeley.edu
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Categorized As
Nanotechnology
Electronics
Materials
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